3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64, Band 64)

Special offers, vouchers and much more! Subscribe to the newsletter and get a one-off 10% discount on your next purchase. By subscribing to the newsletter, you consent to your data being used by advertising partners for newsletter tracking and cross-channel advertising purposes in order to provide you with personalized recommendations and advertising. You can revoke your consent at any time with future effect. You can find further information in the data protection declaration.