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    Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75, Band 75)

     
    From Marin Alexe
    Only 1 items left in stock
    Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75, Band 75)

    Description

    The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

    Product details

    EAN/ISBN:
    9783642059155
    Edition:
    Softcover reprint of the original 1st ed. 2004
    Medium:
    Paperback
    Number of pages:
    519
    Publication date:
    2011-09-30
    Publisher:
    Springer
    EAN/ISBN:
    9783642059155
    Edition:
    Softcover reprint of the original 1st ed. 2004
    Medium:
    Paperback
    Number of pages:
    519
    Publication date:
    2011-09-30
    Publisher:
    Springer

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    Used - very good
    €199.00
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