Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75, Band 75)

Description

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Product details

EAN/ISBN:: 9783642059155
Edition:: Softcover reprint of the original 1st ed. 2004
Medium:: Paperback
Number of pages:: 519
Publication date:: 2011-09-30
Publisher:: Springer
Manufacturer:: Unknown

EAN/ISBN:: 9783642059155
Edition:: Softcover reprint of the original 1st ed. 2004
Medium:: Paperback
Number of pages:: 519
Publication date:: 2011-09-30
Publisher:: Springer
Manufacturer:: Unknown

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